BOND ELECTRONICS LIMITED
(Company Registration No. 0689849)
BOND ELECTRONICS LIMITED was established on 29-Sep-1999, CR No. is: 0689849, The company is Dissolved now, The company belongs to Company. As so far this company has running for25years 2months 1days .
Company Name:
BOND ELECTRONICS LIMITED
Chinese Company Name::
怡邦電子有限公司
Company Registration No.：
0689849
Date of Incorporation:
1999-09-29
Company Type:
Private company limited by shares
Company Status::
Dissolved
Date of Dissolution:
2009-10-09
Date of Annual Examination::
Sep 29 - Nov 10
Remarks:
Dissolved by Deregistration
Register of Charges::
Unavailable
Name History:
19-APR-2004
BOND ELECTRONICS LIMITED
怡邦電子有限公司
02-AUG-2000
CHIP SCALE TECHNOLOGY LIMITED
晶密科技有限公司
29-SEP-1999
B. BACHER ASIA PACIFIC LIMITED
巴馳亞太有限公司
BOND ELECTRONICS LIMITED
怡邦電子有限公司
02-AUG-2000
CHIP SCALE TECHNOLOGY LIMITED
晶密科技有限公司
29-SEP-1999
B. BACHER ASIA PACIFIC LIMITED
巴馳亞太有限公司
Updated on
2019-06-14
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Incorporated on the same day
1999-09-29
1999-09-29