TOP BOND TECHNOLOGY LIMITED
(Company Registration No. 0934308)
TOP BOND TECHNOLOGY LIMITED was established on 17-Nov-2004, CR No. is: 0934308, The company is Dissolved now, The company belongs to Company. As so far this company has running for20years 1weeks 4days .
TOP BOND TECHNOLOGY LIMITED
駿邦科技有限公司
HILL TOP PREPRESS TECHNOLOGY LIMITED
HILL TOP PREPRESS TECHNOLOGY LIMITED was incorporated on 1988-01-29.
TOP BOND INVESTMENTS LIMITED
TOP BOND INVESTMENTS LIMITED was incorporated on 1988-07-29.
TOP RAY TECHNOLOGY LIMITED
TOP RAY TECHNOLOGY LIMITED was incorporated on 1989-03-31.
TOP LEAP TECHNOLOGY LIMITED
TOP LEAP TECHNOLOGY LIMITED was incorporated on 1989-07-28.
TOP SKILL TECHNOLOGY LIMITED
TOP SKILL TECHNOLOGY LIMITED was incorporated on 1991-01-04.
TRIPLE BOND TECHNOLOGY LIMITED
TRIPLE BOND TECHNOLOGY LIMITED was incorporated on 1991-01-29.
JADE BOND TECHNOLOGY LIMITED
JADE BOND TECHNOLOGY LIMITED was incorporated on 1991-03-14.
LINK BOND TECHNOLOGY LIMITED
LINK BOND TECHNOLOGY LIMITED was incorporated on 1991-07-04.
TOP LEADER TECHNOLOGY LIMITED
TOP LEADER TECHNOLOGY LIMITED was incorporated on 1992-10-13.
- top bond technology limited
- framemorable moments limited
- norlag hong kong limited
- asia iron & metals limited
- diamond-hole company limited
- jiu yi international investment group limited
- fes industries (h.k) limited
- demax investments limited
- shine regent investments limited
- hong kong start luck international trading limited
- hong kong you run investment co., limited
- bestway enterprises limited
- gateway creation development limited
- mimolite limited
- houtai construction limited
2004-11-17