BOND TECHNOLOGY LIMITED
(Company Registration No. 0503753)
BOND TECHNOLOGY LIMITED was established on 24-Jan-1995, CR No. is: 0503753, The company is Dissolved now, The company belongs to Company. As so far this company has running for29years 3months 3weeks.
BOND TECHNOLOGY LIMITED
怡邦科技有限公司
TRIPLE BOND TECHNOLOGY LIMITED
TRIPLE BOND TECHNOLOGY LIMITED was incorporated on 1991-01-29.
JADE BOND TECHNOLOGY LIMITED
JADE BOND TECHNOLOGY LIMITED was incorporated on 1991-03-14.
LINK BOND TECHNOLOGY LIMITED
LINK BOND TECHNOLOGY LIMITED was incorporated on 1991-07-04.
CITY BOND TECHNOLOGY LIMITED
CITY BOND TECHNOLOGY LIMITED was incorporated on 2001-05-28.
EVER BOND TECHNOLOGY LIMITED
EVER BOND TECHNOLOGY LIMITED was incorporated on 2002-06-07.
E-BOND TECHNOLOGY LIMITED
E-BOND TECHNOLOGY LIMITED was incorporated on 2004-07-02.
TOP BOND TECHNOLOGY LIMITED
TOP BOND TECHNOLOGY LIMITED was incorporated on 2004-11-17.
CHINA BOND TECHNOLOGY LIMITED
CHINA BOND TECHNOLOGY LIMITED was incorporated on 2006-04-21.
INFO BOND TECHNOLOGY LIMITED
INFO BOND TECHNOLOGY LIMITED was incorporated on 2006-04-21.
- bond technology limited
- bright way (far east) limited
- shung eng (h.k.) limited
- keya development limited
- charm tume company limited
- tak wai industrial co., limited
- rise gain (hong kong) limited
- hk jieercheng int'l group limited
- kowloon tourist service company limited
- future development (hk) limited
- f u m associates limited
- crown century creation limited
- tai woo industrial company limited
- acquirys ventures limited
- new china telecom co. limited
1995-01-24