BOND ELECTRONICS LIMITED
(Company Registration No. 0689849)
BOND ELECTRONICS LIMITED was established on 29-Sep-1999, CR No. is: 0689849, The company is Dissolved now, The company belongs to Company. As so far this company has running for24years 8months.
BOND ELECTRONICS LIMITED
怡邦電子有限公司
02-AUG-2000
CHIP SCALE TECHNOLOGY LIMITED
晶密科技有限公司
29-SEP-1999
B. BACHER ASIA PACIFIC LIMITED
巴馳亞太有限公司
SUPER BOND ELECTRONICS LIMITED
SUPER BOND ELECTRONICS LIMITED was incorporated on 1983-04-22.
KING BOND ELECTRONICS LIMITED
KING BOND ELECTRONICS LIMITED was incorporated on 1983-08-05.
GOLDEN BOND ELECTRONICS LIMITED
GOLDEN BOND ELECTRONICS LIMITED was incorporated on 1990-02-20.
GRAND BOND ELECTRONICS LIMITED
GRAND BOND ELECTRONICS LIMITED was incorporated on 2002-06-26.
U-BOND ELECTRONICS LIMITED
U-BOND ELECTRONICS LIMITED was incorporated on 2006-12-21.
BOND ARRAY ELECTRONICS LIMITED
BOND ARRAY ELECTRONICS LIMITED was incorporated on 1995-02-23.
BOND TECH ELECTRONICS LIMITED
BOND TECH ELECTRONICS LIMITED was incorporated on 1996-04-02.
G-BOND ELECTRONICS (HONGKONG) CO., LIMITED
G-BOND ELECTRONICS (HONGKONG) CO., LIMITED was incorporated on 2008-06-11.
BOND ELECTRONICS CO., LIMITED
BOND ELECTRONICS CO., LIMITED was incorporated on 2017-04-21.
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1999-09-29