BOND TECH (HONG KONG) LIMITED
(Company Registration No. 0805605)

BOND TECH (HONG KONG) LIMITED was established on 10-Jul-2002, CR No. is: 0805605, The company is Dissolved now, The company belongs to Company. As so far this company has running for21years 9months 4weeks.

Company Name:
BOND TECH (HONG KONG) LIMITED
Chinese Company Name::
邦得(香港)有限公司
Company Registration No.:
0805605
Date of Incorporation:
2002-07-10
Company Type:
Private company limited by shares
Company Status::
Dissolved
Date of Dissolution:
2014-01-10
Date of Annual Examination::
Jul 10 - Aug 21
Remarks:
Dissolved by Deregistration
Register of Charges::
Unavailable
Name History:
10-JUL-2002
BOND TECH (HONG KONG) LIMITED
邦得(香港)有限公司
Updated on
2019-06-19
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